PACKAGED DEVICE WITH ADDITIVE SUBSTRATE SURFACE MODIFICATION

摘要

In described examples, a method (100) of lead frame surface modification includes providing (101) at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additive ly deposited (102) including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured (103) to remove the liquid carrier so that a substantially solid ink residue remains.