Micromechanical device encapsulation process with a mechanically reinforced package cap

摘要

The method involves depositing the sacrificial material covering a micro component (100) positioned on and/or in a substrate (102). A cap (104) covering the sacrificial material is realized. The sacrificial material is removed via an opening (108) formed through the cap for forming a cavity (106) in which the micro component is positioned. A plugging material layer (110) is deposited on the cap, where the plugging material plugs the opening. The localized deposition of a portion of mechanically reinforcing material is performed on the cap to cover the cap. The localized deposition is chosen among electrolytic growth when the mechanically reinforcing material is a metal or serigraphy or syringe deposition when the mechanically reinforcing material is a polymer. The mechanically reinforcing material has a Young's modulus below about 150 GPa.