RESIN SHEET FOR SEALING ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE

摘要

Provided are a resin sheet for sealing an electronic device and a method for manufacturing an electronic device package enabling formation of a mark having exceptional visibility by laser marking. The present invention relates to a resin sheet for sealing an electronic device, provided with a first resin layer and a second resin layer, in which the contrast between a marked section after the first resin layer has been laser-marked and a non-marked section is 20% or above.