发明名称 |
METHOD FOR SLICING INGOT AND WIRE SAW |
摘要 |
A method is disclosed for slicing an ingot by which wire rows are formed by using a wire that is spirally wound between a plurality of wire guides and travels in an axial direction. An ingot is pressed against the wire rows while supplying a working fluid to a contact portion of the ingot and the wire, thereby slicing the ingot into wafers, and a ratio of a wire new line feed amount per unit time in slicing of a slicing start portion of a first ingot to that in slicing of a centration portion of the same at the time of slicing the ingot after replacement of the wire is controlled to be ½ or less of the ratio at the time of slicing second and subsequent ingots after the replacement of the wire. |
申请公布号 |
SG11201601186X(A) |
申请公布日期 |
2016.03.30 |
申请号 |
SGX11201601186 |
申请日期 |
2014.07.24 |
申请人 |
SHIN-ETSU HANDOTAI CO.,LTD. |
发明人 |
KANBAYASHI, KEIICHI |
分类号 |
B24B27/06;B28D5/04;H01L21/304 |
主分类号 |
B24B27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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