| 摘要 |
<P>PROBLEM TO BE SOLVED: To bond a metal bump reliably in Fan-out type WLP. <P>SOLUTION: In an electronic device 1, a package component 5 is mounted on a circuit board 2 via a metal bump 4. In the package component 5, a semiconductor chip 11 is covered with a resin 21, and the metal bump 4 can be arranged on the outside of the region of the semiconductor chip 11 by a re-wiring layer 31. A plurality of copper columns 25 are arranged in the resin 21, and one metal bump 4 is arranged under each column 25. When mounting the package component 5 on the circuit board 2, ultrasonic waves is applied to the package component 5 from above and made to propagate with no loss by means of the column 25 thus melting the metal bump 4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
