| 摘要 |
A method of manufacturing a multi-layer printed circuit board by bonding together a plurality of circuit board layers (10) each of which includes a substrate (14) and a conductive circuit pattern (16) on at least one surface of the substrate (14), the method comprising the steps of:
- coating the surface of the substrate (14) with a continuous layer of conductive material (16'),
- masking the layer with a resist (26),
- etching away a part of the conductive material so as to obtain the circuit pattern (16) with conductive parts (18) separated by gaps (20), and
- filling the gaps (20) with an electrically insulating adhesive material (28) to a level that is at least equal to the thickness of the layer of conductive material, characterized in that the resist (26) is left on the conductive parts (18) and the adhesive material (28) is selected to be chemically compatible with the resist (26). |
