| 摘要 |
PURPOSE:To reduce an etching condition in variability so as to improve a circuit forming quality by a method wherein an etchant on a printed board is swept by air jetted from an air supply means during an etching process so as to enable the printed board to be etched under the same condition. CONSTITUTION:An etchant 5 spouted from an etchant nozzle 2 onto a printed board 1 which moves horizontally dissolves a copper foil formed on the printed board 1 and stands on the printed board as an etchant pool 7. The etchant pool 7 is swept away by air jetted from an air blower 3 and an etching is executed through a new etchant spouted from the etchant nozzle 2. Therefore, the unevenness of etching caused by the etchant pool 7 can be decreased. By these processes, a circuit forming quality can be improved. |
