MULTI-STEPPED BOAT FOR RECEIVING SEMICONDUCTOR PACKAGES

摘要

The present invention relates to a boat for accommodating a semiconductor package, which includes: a stack boat having a stack hole for accommodating a semiconductor package smaller than a first semiconductor package to be stacked on the first semiconductor package; and a guide boat which has a guide hole vertically aligned with the stack hole, and can be attached/detached to/from the stack boat. An inner side of the stack hole includes a first step accommodating the first semiconductor package, and a second step accommodating the second semiconductor package, and provided on the first step. The guide hole guides movement of the first semiconductor package accommodated in the first step as being extended toward the stack hole. The boat of the present invention can accommodate semiconductor packages with different sizes.