发明名称 透明な整流性の金属−金属酸化物−半導体接触構造およびその製造方法および使用
摘要 The invention relates to transparent rectifying contact structures for application in electronic devices, in particular appertaining to optoelectronics, solar technology and sensor technology, and also a method for the production thereof. The transparent rectifying contact structure according to the invention has the following constituents: a) a transparent semiconductor, b) a transparent, non-insulating and non-conducting layer composed of metal oxide, metal sulphide and/or metal nitride, the resistivity of which is preferably in the range of 102 Omegacm to 107 Omegacm and c) a layer composed of a transparent electrical conductor wherein the layer b) is formed between the semiconductor a) and the layer c) and the composition of the layer b) is defined in greater detail in the description of the patent.
申请公布号 JP5897621(B2) 申请公布日期 2016.03.30
申请号 JP20140031391 申请日期 2014.02.21
申请人 ウニベルジテート・ライプツィヒ 发明人 グルントマン・マリウス;フレンツェル・ハイコ;ライン・アレクサンダー;フォン・ヴェンックシュテルン・ホルガー
分类号 H01L29/47;H01L21/28;H01L21/338;H01L29/267;H01L29/812;H01L29/861;H01L29/868;H01L29/872;H01L31/108 主分类号 H01L29/47
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