Paste and method for connecting electronic components with a substrate

摘要

A paste comprises: metal particles; at least one activator having at least two carboxylic acid units in its molecule; and a dispersion medium. An independent claim is included for connecting at least one electronic component to at least one substrate through contact regions involving: providing a substrate having a first contact region and an electronic component having a second contact region, where the contact regions contains a non-noble metal; providing the paste; generating a structure, where the first contact region of the substrate contacts the second contact region of the electronic component through the paste; and sintering the structure while producing a module comprising the substrate and the electronic component connected to each other through the sintered paste.