IC STRUCTURE AND MANUFACTURING METHOD WITH THROUGH THICKNESS COAXIAL STRUCTURES

摘要

The present invention relates to a multi-layered electronic support structure, and a manufacturing method. The multi-layered electronic support structure comprises: a plurality of dielectric layers extended in an X-Y plane, and at least one coaxial pair of stack posts extended through at least one dielectric layer in a Z direction practically perpendicular to the X-Y plane. The coaxial pair of stack posts includes a central post surrounded by a toroidal post separated from the central post by a separation tube of a dielectric.