| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module that allows preventing the occurrence of a surge voltage without increasing components disposed in a region sealed by a molding resin.SOLUTION: A semiconductor module 1 includes: a package 10 in which a semiconductor element 2 is sealed; and a positive electrode 21 and a negative electrode 22 disposed so as to face each other with the package 10 interposed therebetween, and electrically connected to the semiconductor element 2. The positive electrode 21 has a positive-electrode protruding portion 21b protruding toward the negative electrode 22 side. The negative electrode 22 has a negative-electrode protruding portion 22b facing the positive-electrode protruding portion 21b and protruding toward the positive electrode 21 side. The semiconductor module 1 has a power storage portion 30 capable of storing charges between the positive-electrode protruding portion 21b and the negative-electrode protruding portion 22b. |
