| 摘要 |
The present invention provides a mold release film having both mold release properties and embedding performance. The mold release film (1) according to the present invention comprises: a base layer (2) which comprises a polyolefin resin and a polystyrene resin having a syndiotactic structure; and a first mold release layer (3) which is arranged on the upper surface of the base layer (2) and is composed of a resin material containing a polystyrene resin having a syndiotactic structure as the main component. The mold release film (1) has a tensile storage elastic modulus (E') of 1.0 × 106 to 5.0 × 108 Pa at 120°C and 1.0 × 107 to 1.0 × 109 Pa at 170°C as measured by a test method in accordance with JIS K 7244 under such conditions that the length of a test piece is 40 mm, the width of the test piece is 4 mm, the length of the test piece between clamps is 20 mm, the measurement starting temperature is 25°C, the measurement termination temperature is 250°C, the temperature rising rate is 5°C/min, and the measurement frequency is 1 Hz. |
