发明名称 基板支持ブッシング
摘要 A bushing assembly for supporting a substrate within a processing chamber is generally provided. In one aspect, the bushing assembly comprises a tubular body having an outer perimeter and an aperture extending therethrough, a first ring having a first inner edge, the first ring disposed in the aperture in an upper portion of the tubular body, and a second ring having a second inner edge, the second ring disposed in the aperture in a lower portion of the tubular body. In another aspect, the first inner edge has a first radius of curvature, and the second inner edge has a second radius of curvature. In another aspect, a first inner edge diameter, a second inner edge diameter, the first radius of curvature, and the second radius of curvature are selected such that a support pin extending through the aperture contacts the bushing assembly on at most two points.
申请公布号 JP5896387(B2) 申请公布日期 2016.03.30
申请号 JP20140537089 申请日期 2012.10.01
申请人 アプライド マテリアルズ インコーポレイテッドAPPLIED MATERIALS,INCORPORATED 发明人 ホウ タオ;オー ジョンフン;チョ トム ケイ;マトロシュ アンジェイ;フーシュダラン フランク エフ;ヤン ヤオ−フン
分类号 H01L21/683;C23C14/50;C23C16/458;H01L21/3065 主分类号 H01L21/683
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