| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that strikes a balance between high thermostability and high thermal conductivity; and to provide a powdery sealing material and electronic parts, each using the same. <P>SOLUTION: The thermosetting resin composition contains: (A) a thermosetting resin having an imide skeleton in a molecule and an allyl group as a functional group; (B) a maleimide compound; and (C) an inorganic filler. The inorganic filler contains more than 80 mass%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
