发明名称 |
SEMICONDUCTOR MODULE, MOULD DEVICE, AND MOULD-FORMING METHOD |
摘要 |
A semiconductor module includes a plurality of semiconductor elements, a first tabular electrode coupled to one face side of the plurality of semiconductor elements, a second tabular electrode coupled to the other face side of the plurality of semiconductor elements, and a molding material that encapsulates the plurality of semiconductor elements between the first electrode and the second electrode. A protrusion extending toward the second electrode is provided in a circumferential edge portion of the first electrode, and the protrusion surrounds the molding material. |
申请公布号 |
EP2660858(A4) |
申请公布日期 |
2016.03.30 |
申请号 |
EP20110852808 |
申请日期 |
2011.11.10 |
申请人 |
NISSAN MOTOR CO., LTD |
发明人 |
ADACHI, SHUUJI;KOMIYAMA, FUMIYUKI;KOBAYASHI, SHUUJI |
分类号 |
H01L21/56;B29C33/14;H01L25/07;H01L25/18 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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