SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a semiconductor package. The semiconductor package includes: a wiring substrate including multiple solder pads placed away from each other; a chip including multiple chip pads connected with the solder pads in a flip-chip shape through multiple solders; a sealing layer configured to seal the chip and the solders, and formed with at least one void between the solders; and a solder leak preventing layer formed on a side wall of the solders exposed by the void. Therefore, the present invention is capable of preventing a short circuit between adjacent solders.