发明名称 |
SLURRY, POLISHING-LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHING SUBSTRATE, AND SUBSTRATE |
摘要 |
A polishing liquid comprises: abrasive grains; a compound having an aromatic heterocycle; an additive (excluding the compound having an aromatic heterocycle); and water, wherein: the abrasive grains include a hydroxide of a tetravalent metal element; the aromatic heterocycle has an endocyclic nitrogen atom not bound to a hydrogen atom; and a charge of the endocyclic nitrogen atom obtained by using the Merz-Kollman method is −0.45 or less. |
申请公布号 |
SG11201600902W(A) |
申请公布日期 |
2016.03.30 |
申请号 |
SG11201600902W |
申请日期 |
2014.07.01 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MINAMI HISATAKA;IWANO TOMOHIRO;ARAKAWA KEITA;HIDAKA TAKAHIRO |
分类号 |
H01L21/304;C09K3/14 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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