发明名称 SLURRY, POLISHING-LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHING SUBSTRATE, AND SUBSTRATE
摘要 A polishing liquid comprises: abrasive grains; a compound having an aromatic heterocycle; an additive (excluding the compound having an aromatic heterocycle); and water, wherein: the abrasive grains include a hydroxide of a tetravalent metal element; the aromatic heterocycle has an endocyclic nitrogen atom not bound to a hydrogen atom; and a charge of the endocyclic nitrogen atom obtained by using the Merz-Kollman method is −0.45 or less.
申请公布号 SG11201600902W(A) 申请公布日期 2016.03.30
申请号 SG11201600902W 申请日期 2014.07.01
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 MINAMI HISATAKA;IWANO TOMOHIRO;ARAKAWA KEITA;HIDAKA TAKAHIRO
分类号 H01L21/304;C09K3/14 主分类号 H01L21/304
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