发明名称 Electrical connector
摘要 Electrical connectors that are mating compatible with the MicroTCA® standard and configured to be mounted to an underlying substrate are provided. Certain of the electrical connectors can be configured to be mounted to a substrate configured in accordance with the MicroTCA® press fit footprint. Additionally, electrical connectors that are mating compatible with the MicroTCA® standard and configured to be mounted to respective alternative footprints, and substrates configured in accordance with the respective alternative footprints are provided. The disclosed electrical connectors and corresponding substrate footprints can operate to transmit data at speed up to and in excess of 25 Gigabits per second.
申请公布号 US9300103(B2) 申请公布日期 2016.03.29
申请号 US201414323249 申请日期 2014.07.03
申请人 FCI AMERICAS TECHNOLOGY LLC 发明人 Buck Jonathan E.;Rengarajan Madhumitha
分类号 H01R13/648;H01R43/20;H01R12/58;H01R12/73;H01R13/6461 主分类号 H01R13/648
代理机构 Baker & Hostetler LLP 代理人 Baker & Hostetler LLP
主权项 1. A method of fabricating an electrical connector, the method comprising the steps of: supporting a plurality electrical signal contacts in a connector housing, the signal contacts defining signal mounting ends and mating ends, wherein respective pairs of the plurality of electrical signal contacts define differential signal pairs; supporting first and second ground plates in the connector housing, each of the plurality of first and second ground plates including ground mounting ends and ground mating ends, wherein the two supporting steps include defining one hundred seventy matting ends that are spaced along two columns that each extend along a row direction collectively from the mating ends of the plurality of electrical signal contacts to the ground mating ends, the one hundred seventy mating ends defining a 0.75 mm column pitch, and positioning the plurality of electrical signal contacts and the ground plates in the connector housing such that the signal and ground mounting ends define a footprint that differs from a footprint defined by vias of a printed circuit board that are arranged in accordance with MicroTCA specification Rev. 1.0, such that the electrical signal contacts are configured to transfer data between the mounting ends and the mating ends at a minimum of approximately 12.5 Gigabits/second at an acceptable level of near-end crosstalk.
地址 Carson City NV US