Time-variant temperature-based 2-D and 3-D wire routing

摘要

Various features pertain to circuit design schemes that route wires based on temperature. In one aspect, time-variant temperature conditions along a prospective route are taken into account when determining whether to use the route for a wire. For example, a route can be selected from among a set of prospective two-dimensional (2-D) or three-dimensional (3-D) routes based on which route is associated with the “smoothest” temperature gradient. Other aspects of the disclosure pertain to determining or exploiting adjustable search windows, layer wiring densities, worst-case skew values and resistance-capacitance (RC) coupling characteristics, particularly for use with 3-D routing within the layers of a stacked multi-layer substrate.

主权项

1. A routing apparatus, comprising:
a memory device; and a processing circuit coupled to the memory device and configured to:
identify a plurality of prospective routes for routing a wire through at least one substrate;determine, for each of the prospective routes, a time-variant temperature characteristic associated with the prospective route;select one of the prospective routes based on a skew determined for each of the prospective routes using the time-variant temperature characteristic associated with the each of the prospective routes;store an indication of the selected route in the memory device; andprovide design data including the indication of the selected route that may be used to manufacture an integrated circuit, substrate or printed circuit board.