发明名称 |
Electronic device |
摘要 |
According to one embodiment, an electronic device includes: a first housing including a first wall; a reinforcing member that is overlapped on an inner surface of the first wall and is bonded to the first wall; an electric component including a second wall located at a side opposite to the first wall with respect to the reinforcing member, a third wall located at a side opposite to the reinforcing member with respect to the second wall and spaced from the second wall, and a fourth wall connecting the second wall and the third wall, the electric component being accommodated in the first housing, and a first protrusion that is provided to the reinforcing member and projects toward the fourth wall. |
申请公布号 |
US9298232(B2) |
申请公布日期 |
2016.03.29 |
申请号 |
US201314015898 |
申请日期 |
2013.08.30 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Matsumoto Yasuo;Nakamura Toshikatsu |
分类号 |
G06F1/20;H05K7/20;H01L23/467;H05K5/00 |
主分类号 |
G06F1/20 |
代理机构 |
Knobbe, Martens Olson & Bear LLP |
代理人 |
Knobbe, Martens Olson & Bear LLP |
主权项 |
1. An electronic device comprising:
a first housing comprising a first wall; a reinforcing member that is overlapped on an inner surface of the first wall and is bonded to the first wall; an electric component comprising a second wall located at a side opposite to the first wall with respect to the reinforcing member, a third wall located at a side opposite to the reinforcing member with respect to the second wall and spaced from the second wall, and a fourth wall connecting the second wall and the third wall, the electric component being accommodated in the first housing, and a first protrusion that is provided to the reinforcing member and projects toward the fourth wall wherein the first protrusion contacting with the fourth wall is shored between the fourth wall and the first wall wherein the first wall comprises a first opening, the reinforcing member comprises a second opening overlapped with the first opening, and the first protrusion is provided around the second opening. |
地址 |
Tokyo JP |