发明名称 |
Electronic component and method for producing same |
摘要 |
This electronic component is provided with an inorganic substrate, a conductor film formed on a surface of the substrate, and bonding wires bonded to a part of said conductor film, and wire bonding sections are formed on at least a part of the electronic component. The part of the conductor film at least forming the aforementioned wire bonding sections contains an Ag-based metal formed of Ag or an alloy having Ag as the main constituent and a metal oxide which coats said Ag-based metal and which has, as a constituent element, any of the elements selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg, and Zn. The coating quantity of the metal oxide is a quantity corresponding to 0.02 to 0.1 parts by mass relative to 100 parts by mass of the aforementioned Ag-based metal. |
申请公布号 |
US9299653(B2) |
申请公布日期 |
2016.03.29 |
申请号 |
US201113696862 |
申请日期 |
2011.05.09 |
申请人 |
TDK CORPORATION;NORITAKE CO., LTD. |
发明人 |
Satoh Minoru;Yamashita Takehiro;Nagai Atsushi;Adachi Yasuo |
分类号 |
H05K7/04;H01B1/02;H01L23/498;H01B1/16;H01L23/00;H01K13/04;H01L23/15 |
主分类号 |
H05K7/04 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. An electronic component comprising:
an inorganic substrate; a wet plating-less conductor film formed on a surface of said substrate, at least a part of the conductor film having wire bonding sections; and bonding wires directly bonded to the wire bonding sections within at least a part of the conductor film; wherein: the wire bonding sections contain:
an Ag-based metal formed of Ag or an alloy having Ag as a main constituent; anda metal oxide coating said Ag-based metal and having, as a constituent element, any of the elements selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg, and Zn; and the metal oxide that coats the Ag-based metal is present in an amount in a range of from 0.02 to 0.1 parts by mass relative to 100 parts by mass of the Ag-based metal. |
地址 |
Tokyo JP |