Semiconductor package having a cap unit with concave portion and method of manufacturing the same

摘要

A semiconductor package of an embodiment includes: a semiconductor chip having a signal input terminal and a signal output terminal; and a cap unit that is formed on the semiconductor chip. The cap unit includes a concave portion forming a hollow structure between the semiconductor chip and the cap unit, a first through electrode electrically connected to the signal input terminal, and a second through electrode electrically connected to the signal output terminal. Of the inner side surfaces of the concave portion, a first inner side surface and a second inner side surface facing each other are not parallel to each other.

主权项

1. A semiconductor package comprising:
a semiconductor chip having a signal input terminal and a signal output terminal; and a cap unit provided above the semiconductor chip, the cap unit including, a concave portion forming a hollow structure between the semiconductor chip and the cap unit, the concave portion having a first inner side surface and a second inner side surface facing each other, a first line of intersection between the first inner side surface and a plane parallel to a surface of the semiconductor chip and a second line of intersection between the second inner side surface and the plane are not parallel to each other, a first electrode electrically connected to the signal input terminal, one end of the first electrode exposed at a first surface of the cap unit and the other end of the first electrode exposed at a second surface of the cap unit opposite to the first surface, and a second electrode electrically connected to the signal output terminal, one end of the second electrode exposed at the first surface of the cap unit and the other end of the second electrode exposed at a third surface of the cap unit opposite to the first surface.