发明名称 Method for fabricating nitride semiconductor thin film and method for fabricating nitride semiconductor device using the same
摘要 A method for fabricating a nitride semiconductor thin film includes preparing a first nitride single crystal layer doped with an n-type impurity. A plurality of etch pits are formed in a surface of the first nitride single crystal layer by applying an etching gas thereto. A second nitride single crystal layer is grown on the first nitride single crystal layer having the etch pits formed therein.
申请公布号 US9299561(B2) 申请公布日期 2016.03.29
申请号 US201414250070 申请日期 2014.04.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Lee Keon Hun;Kim Min Ho;Seo Jong Uk;Yoon Suk Ho;Lee Kee Won;Lee Sang Don;Lee Ho Chul
分类号 H01L33/02;H01L21/02;H01L33/00;H01L33/22 主分类号 H01L33/02
代理机构 McDermott Will & Emery LLP 代理人 McDermott Will & Emery LLP
主权项 1. A method for fabricating a nitride semiconductor thin film, the method comprising: preparing a first nitride single crystal doped with an n-type impurity; forming a plurality of etch pits in a surface of the first nitride single crystal by applying an etching gas thereto; growing a second nitride single crystal on the first nitride single crystal having the etch pits formed therein; and forming a plurality of etch pits in a surface of the second nitride single crystal by applying the etching gas thereto after the growth of the second nitride single crystal.
地址 Suwon-Si, Gyeonggi-do KR