发明名称 |
Method for fabricating nitride semiconductor thin film and method for fabricating nitride semiconductor device using the same |
摘要 |
A method for fabricating a nitride semiconductor thin film includes preparing a first nitride single crystal layer doped with an n-type impurity. A plurality of etch pits are formed in a surface of the first nitride single crystal layer by applying an etching gas thereto. A second nitride single crystal layer is grown on the first nitride single crystal layer having the etch pits formed therein. |
申请公布号 |
US9299561(B2) |
申请公布日期 |
2016.03.29 |
申请号 |
US201414250070 |
申请日期 |
2014.04.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
Lee Keon Hun;Kim Min Ho;Seo Jong Uk;Yoon Suk Ho;Lee Kee Won;Lee Sang Don;Lee Ho Chul |
分类号 |
H01L33/02;H01L21/02;H01L33/00;H01L33/22 |
主分类号 |
H01L33/02 |
代理机构 |
McDermott Will & Emery LLP |
代理人 |
McDermott Will & Emery LLP |
主权项 |
1. A method for fabricating a nitride semiconductor thin film, the method comprising:
preparing a first nitride single crystal doped with an n-type impurity; forming a plurality of etch pits in a surface of the first nitride single crystal by applying an etching gas thereto; growing a second nitride single crystal on the first nitride single crystal having the etch pits formed therein; and forming a plurality of etch pits in a surface of the second nitride single crystal by applying the etching gas thereto after the growth of the second nitride single crystal. |
地址 |
Suwon-Si, Gyeonggi-do KR |