| 发明名称 | Polishing control using weighting with default sequence | ||
| 摘要 | A method of controlling polishing includes storing a sequence of default values, polishing a substrate, monitoring the substrate during polishing with an in-situ monitoring system, generating a sequence of measured values from measurements from the in-situ monitoring system, combining the sequence of measured values with the sequence of default values to generate a sequence of modified values, fitting a function to the sequence of modified values, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the function. | ||
| 申请公布号 | US9296084(B2) | 申请公布日期 | 2016.03.29 |
| 申请号 | US201213553038 | 申请日期 | 2012.07.19 |
| 申请人 | Applied Materials, Inc. | 发明人 | Zhang Jimin;Wang Zhihong;Lee Harry Q.;Tu Wen-Chiang |
| 分类号 | B24B37/013;B24B37/10;B24B49/12 | 主分类号 | B24B37/013 |
| 代理机构 | Fish & Richardson P.C. | 代理人 | Fish & Richardson P.C. |
| 主权项 | 1. A method of controlling polishing, comprising: storing a sequence of default values; polishing a substrate; monitoring the substrate during polishing with an in-situ monitoring system; generating a sequence of measured values from measurements from the in-situ monitoring system; combining the sequence of measured values with the sequence of default values to generate a sequence of modified values; fitting a function to the sequence of modified values; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the function. | ||
| 地址 | Santa Clara CA US | ||