发明名称 Interposer based imaging sensor for high-speed image acquisition and inspection systems
摘要 The present invention includes an interposer disposed on a surface of a substrate, a light sensing array sensor disposed on the interposer, the light sensing array sensor being back-thinned and configured for back illumination, the light sensing array sensor including columns of pixels, one or more amplification circuitry elements configured to amplify an output of the light sensing array sensor, the amplification circuits being operatively connected to the interposer, one or more analog-to-digital conversion circuitry elements configured to convert an output of the light sensing array sensor to a digital signal, the ADC circuitry elements being operatively connected to the interposer, one or more driver circuitry elements configured to drive a clock or control signal of the array sensor, the interposer configured to electrically couple at least two of the light sensing array sensor, the amplification circuits, the conversion circuits, the driver circuits, or one or more additional circuits.
申请公布号 US9299738(B1) 申请公布日期 2016.03.29
申请号 US201414299749 申请日期 2014.06.09
申请人 KLA-Tencor Corporation 发明人 Brown David L.;Zheng Guowu;Chuang Yung-Ho Alex;Iyer Venkatraman
分类号 G01T1/20;H01L27/146;H04N5/335 主分类号 G01T1/20
代理机构 Suiter Swantz pc llo 代理人 Suiter Swantz pc llo
主权项 1. An interposer-based image sensing device, comprising: at least one interposer disposed on a surface of a substrate; at least one light sensing array sensor disposed on the at least one interposer, the at least one light sensing array sensor being back-thinned, the at least one light sensing array sensor configured for back illumination, the at least one light sensing array sensor including a plurality of columns of pixels, the at least one interposer positioned between the substrate and the at least one light sensing array sensor; at least two analog-to-digital conversion circuitry elements configured to convert one or more outputs of the at least one light sensing array sensor to one or more digital signals, the at least two analog-to-digital conversion circuits being fabricated on the interposer; and at least one multiplexer being operatively connected to the interposer and being configured to combine the one or more digital signals from the at least two analog-to-digital conversion circuits, the interposer configured to electrically couple the at least one light sensing array sensor and the at least two analog-to-digital conversion circuits.
地址 Milpitas CA US