Exposure apparatus and exposure method thereof

摘要

An exposure apparatus is provided for performing an unidirectional scan-exposure. The exposure apparatus includes a base and a wafer stage group having a plurality of wafer stages on the base for holding wafers and successively moving from a first position to a second position of the base cyclically. The exposure apparatus also includes an alignment detection unit above the first position for detecting wafer stage fiducials at the first position and alignment marks on a wafer on the wafer stage to align the wafer. Further, the exposure apparatus includes a reticle stage on the second position for loading a cylindrical reticle and causing the cylindrical reticle to rotate around the center axis of the reticle stage and an optical projection unit between the reticle stage and the base for projecting light passing through the cylindrical reticle onto exposure regions on a wafer on the wafer stage.

主权项

1. An exposure apparatus, comprising:
a base; a wafer stage group having a plurality of wafer stages on the base for holding wafers and successively moving from a first position to a second position of the base cyclically; an alignment detection unit above the first position for detecting wafer stage fiducials on the wafer stage at the first position and alignment marks on a wafer on the wafer stage at the first position to align the wafer; a reticle stage on the second position for loading a cylindrical reticle and causing the cylindrical reticle to rotate around a center axis of the reticle stage; and an optical projection unit between the reticle stage and the base for projecting light passing through the cylindrical reticle on exposure regions of a wafer on the wafer stage, wherein a control system is configured to control the wafer stage group such that: when the wafer stage moves from the first position to the second position, the wafer stage performs a unidirectional scan along an scanning direction, the cylindrical reticle rotates around the center axis of the reticle stage, the light passing through the cylindrical reticle is projected onto the wafer on the wafer stage, and a column of exposure regions on the wafer along the scanning direction are exposed, and a first column of exposure regions on a first wafer and a corresponding column of exposure regions on a second wafer are each exposed prior to exposing a second column of the exposure regions on the first wafer.