Methods for forming vias in glass substrates

摘要

Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.

主权项

1. A method of forming a via in a glass substrate, the method comprising:
laser drilling the via through at least a portion of a thickness of the glass substrate, wherein the via is laser drilled through the glass substrate from an incident surface of the glass substrate; etching the glass substrate for an etching duration, thereby increasing a diameter of an incident opening of the via; and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration, wherein the ultrasonic energy has a frequency between 40 kHz and 192 kHz, and wherein the ultrasonic energy has a first frequency and a second frequency or the ultrasonic energy is centered about a primary frequency and dithered or swept above and below the primary frequency.