Attachment devices and methods for light emitting devices

摘要

Attachment devices and methods for use with light emitting devices are provided. In one aspect, the light emitting device can include a submount and a light emission area disposed over the submount. The device can further include at least one attachment member provided on the submount. The attachment member can engage an electrical component thereby providing a gas-tight, solder free connection between the attachment member and electrical component.

主权项

1. A light emitting device comprising:
a submount; a light emission area comprising a plurality of light emitting diode (LED) chips, disposed over the submount; and at least one attachment member provided on the submount for engaging an electrical component and providing a solder free connection between the electrical component and the attachment member, wherein the attachment member is configured to displace a portion of the electrical component, and wherein each LED chip and the attachment member are disposed on a same surface of the submount.