| 发明名称 |
Thermal vias disposed in a substrate without a liner layer |
| 摘要 |
An apparatus relating generally to a substrate is disclosed. In such an apparatus, the substrate has formed therein a plurality of vias. A liner layer is located on the substrate, including being located in a subset of the plurality of vias. At least one of the plurality of vias does not have the liner layer located therein. A thermally conductive material is disposed in the at least one of the plurality of vias to provide a thermal via structure. |
| 申请公布号 |
US9299572(B2) |
申请公布日期 |
2016.03.29 |
| 申请号 |
US201414201473 |
申请日期 |
2014.03.07 |
| 申请人 |
Invensas Corporation |
发明人 |
Gao Guilian |
| 分类号 |
H01L23/48;H01L21/306;H01L21/768;H01L21/311;H01L21/308;H01L21/321;H01L23/367;H01L23/538 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus, comprising:
a substrate having formed therein a plurality of vias; a liner layer located on the substrate including being located in a subset of the plurality of vias; wherein at least one of the plurality of vias does not have the liner layer located therein; a thermally conductive material disposed in the at least one of the plurality of vias without a liner layer to provide a thermal via structure for conducting heat from one die to another die to conduct to a heat sink; and a conductive material different than the thermally conductive material disposed in the subset of the plurality of vias having the liner layer. |
| 地址 |
San Jose CA US |
