| 发明名称 | Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof | ||
| 摘要 | A method of manufacture of an integrated circuit packaging system includes: providing a terminal having a top with a depression; applying a dielectric material in the depression, the dielectric material having a gap formed therein and exposing a portion of the top therefrom; forming a trace within the gap and in direct contact with the top, the trace extending laterally over an upper surface of the dielectric material; and connecting an integrated circuit to the terminal through the trace. | ||
| 申请公布号 | US9299644(B1) | 申请公布日期 | 2016.03.29 |
| 申请号 | US201414285601 | 申请日期 | 2014.05.22 |
| 申请人 | STATS ChipPAC Ltd. | 发明人 | Do Byung Tai;Trasporto Arnel;Camacho Zigmund Ramirez |
| 分类号 | H01L23/495 | 主分类号 | H01L23/495 |
| 代理机构 | Ishimaru & Associates LLP | 代理人 | Ishimaru & Associates LLP |
| 主权项 | 1. An integrated circuit packaging system comprising: a terminal having a top with a plateau and a depression; a dielectric material in the depression, the dielectric material having a gap formed therein and exposing a portion of the top therefrom, and the dielectric material directly above a peripheral portion of the plateau; a trace within the gap and in direct contact with the top, the trace extending laterally over an upper surface of the dielectric material; and an integrated circuit connected to the terminal through the trace. | ||
| 地址 | Singapore SG | ||