| 发明名称 | Packaged semiconductor devices and methods of packaging semiconductor devices | ||
| 摘要 | Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes forming a mask coating over a carrier, coupling an integrated circuit die over the mask coating, and disposing a molding compound around the integrated circuit die. The method includes forming an interconnect structure over the integrated circuit die and the molding compound. | ||
| 申请公布号 | US9299688(B2) | 申请公布日期 | 2016.03.29 |
| 申请号 | US201414182574 | 申请日期 | 2014.02.18 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Yu Chen-Hua;Liu Chung-Shi;Huang Chih-Fan;Huang Hui-Min;Lin Wei-Hung;Cheng Ming-Da |
| 分类号 | H01L21/10;H01L21/105;H01L25/10;H01L21/56;H01L21/78;H01L23/538;H01L23/00;H01L21/683;H01L23/498 | 主分类号 | H01L21/10 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A method of packaging a semiconductor device, the method comprising: coating over a carrier substrate with a mask coating; coupling an integrated circuit die over the mask coating; disposing a molding compound around the integrated circuit die and on the mask coating; and forming an interconnect structure over the integrated circuit die and the molding compound. | ||
| 地址 | Hsin-Chu TW | ||