发明名称 Ion implant for defect control
摘要 Various methods for implanting dopant ions into a three dimensional feature of a semiconductor wafer are disclosed. The implant temperature may be varied to insure that the three dimensional feature, after implant, has a crystalline inner core, which is surrounded by an amorphized surface layer. The crystalline core provides a template from which the crystalline structure for the rest of the feature can be regrown. In some embodiments, the implant energy and the implant temperature may each be modified to achieve the desired crystalline inner core with the surrounding amorphized surface layer.
申请公布号 US9299564(B2) 申请公布日期 2016.03.29
申请号 US201313897666 申请日期 2013.05.20
申请人 Varian Semiconductor Equipment Associates, Inc. 发明人 Waite Andrew M.;Todorov Stanislav S.
分类号 H01L21/322;H01L21/223;H01L29/66;H01L21/265 主分类号 H01L21/322
代理机构 代理人
主权项 1. A method of implanting dopant ions into a three dimensional feature of a semiconductor wafer, comprising: implanting said dopant ions into said three dimensional feature at a plurality of incident angles at an implant energy and implant temperature so as to create an amorphized surface layer surrounding a crystalline inner core, wherein, after implanting, said three dimensional feature consists of an amorphized surface layer and a crystalline inner core, and wherein said three dimensional feature has a feature width, and said crystalline inner core has a width of less than one half of said feature width.
地址 Gloucester MA US