发明名称 Printed transistor and fabrication method
摘要 A method for fabricating a thin film transistor includes printing source, drain and channel regions on a passivated transparent substrate, forming a gate dielectric over the channel region and forming a gate conductor over the gate dielectric. A permanent antireflective coating is deposited over the source region, drain region and gate electrode, and an interlevel dielectric layer is formed over the permanent antireflective coating. Openings in the permanent antireflective coating and the interlevel dielectric layer are formed to provide contact holes to the source region, drain region and gate electrode. A conductor is deposited in the contact holes to electrically connect to the source region, drain region and gate electrode. Thin film transistor devices and other methods are also disclosed.
申请公布号 US9299847(B2) 申请公布日期 2016.03.29
申请号 US201514741169 申请日期 2015.06.16
申请人 GLOBALFOUNDRIES INC. 发明人 Lin Qinghuang;Lu Minhua;Wisnieff Robert L.
分类号 H01L23/48;H01L29/786;H01L27/12;H01L29/66;H01L23/532;H01L21/283;H01L51/00 主分类号 H01L23/48
代理机构 Hoffman Warnick LLC 代理人 Ivers Catherine;Hoffman Warnick LLC
主权项 1. A thin film transistor, comprising: source, drain and channel regions printed on a passivated transparent substrate; a gate dielectric formed over the channel region; a gate conductor formed over the gate dielectric; a permanent antireflective coating formed over the source region, drain region and gate electrode; an interlevel dielectric layer formed over the permanent antireflective coating, the permanent antireflective coating and the interlevel dielectric layer being configured to provide holes for contacting the source region, drain region and gate electrode; and contacts formed through the interlevel dielectric layer and the permanent antireflective coating to electrically connect to the source region, drain region and gate electrode.
地址 Grand Cayman KY