发明名称 Wafer stage with reciprocating wafer stage actuation control
摘要 A wafer stage system with reciprocating wafer stage actuation control may include a wafer stage, a motor configured to actuate the wafer stage in a first and/or second direction along an axis, a first reciprocating mechanism configured to decelerate the wafer stage after the wafer stage is actuated to a desired position in the first direction, the first reciprocating mechanism configured to store energy captured while decelerating the wafer stage in the first direction, the first reciprocating mechanism configured to accelerate the wafer stage in the second direction, and a second reciprocating mechanism configured to decelerate the wafer stage after the wafer stage is actuated to a desired position in the second direction, the second reciprocating mechanism configured to store energy captured while decelerating the wafer stage in the second direction, the second reciprocating mechanism further configured to accelerate the wafer stage in the first direction.
申请公布号 US9298106(B1) 申请公布日期 2016.03.29
申请号 US201213606951 申请日期 2012.09.07
申请人 KLA-Tencor Corporation 发明人 Ummethala Upendra;Zywno Marek;Hale Layton
分类号 G03F7/20;H01L21/68 主分类号 G03F7/20
代理机构 Suiter Swantz pc llo 代理人 Suiter Swantz pc llo
主权项 1. A wafer stage system with reciprocating wafer stage actuation control, comprising: a wafer stage configured for receiving a wafer; one or more motors configured to actuate the wafer stage in at least one of a first direction or a second direction along at least one axis; a first non-contact magnetic reciprocating mechanism configured to decelerate the wafer stage after the wafer stage is actuated to a desired position in the first direction, the first reciprocating mechanism further configured to store energy captured while decelerating the wafer stage in the first direction, the first reciprocating mechanism further configured to accelerate the wafer stage in the second direction utilizing the energy stored in the first reciprocating mechanism; and a second non-contact magnetic reciprocating mechanism configured to decelerate the wafer stage after the wafer stage is actuated to a desired position in the second direction, the second reciprocating mechanism further configured to store energy captured while decelerating the wafer stage in the second direction, the second reciprocating mechanism further configured to accelerate the wafer stage in the first direction utilizing the energy stored in the second reciprocating mechanism, wherein at least one of the first non-contact magnetic reciprocating mechanism or the second non-contact magnetic reciprocating mechanism are disposed at opposite ends of a scanning path along the at least one axis and include one or more spring mechanisms.
地址 Milpitas CA US