主权项 |
1. A method of manufacturing a connector formed with a gold alloy plating film, comprising:
performing nickel plating on a contact region of the connector to deposit a nickel film on the contact region; and performing gold alloy plating on the nickel film; wherein the gold alloy plating is electrolytic plating at a current density of 10 A/dm2 to 70 A/dm2 and using an acidic gold alloy plating solution consisting of gold cyanide or salt thereof, cobalt ions, one or more acids or salts thereof selected from the group consisting of aminotrimethylene phosphonic acid, 1-hydroxyethyl-idene-1,1-diphosphonic acid, ethylenediamine tetramethylene phosphonic acid, diethylene-triamine pentamethylene phosphonic acid, phosphoric acid, sulfurous acid, amino acids and carboxylic acids wherein the carboxylic acids are selected from the group consisting of citric acid, tartaric acid, oxalic acid, succinic acid, adipic acid, malic acid, lactic acid, pyridine carboxylic acids, thiocarboxylic acids and benzoic acid, between 0.05 g/L and 10 g/L of hexamethylene tetramine, and a nitrogen atom containing compound selected from the group consisting of alkanolamines, dialkanolamines and trialkanolamines and a pH of between 3 and 6 and water and optionally antifungal agents and optionally surfactants. |