Device for thermal management of surface mount devices during reflow soldering

摘要

An apparatus includes a top plate sized to cover components for a PCB in a solder operation to attach the components to a top surface of the PCB. The apparatus may include heat shielding devices and/or heat attracting devices. Each heat shielding device reduces heat transfer to a component to be soldered to the PCB and is positioned in the top plate to decrease heat to the component corresponding to the heat shielding device. Each heat attracting device increases heat transfer to a component to be soldered to the PCB and each heat attracting device is positioned in the top plate to increase heat to the component under the heat attracting device. The top plate is coupled to the heat shielding and/or heat attracting devices and includes a recess for each component configured with a heat shielding device or a heat attracting device.

主权项

1. An apparatus comprising:
a top plate comprising a top side and a bottom side, the bottom side oriented toward a printed circuit board (“PCB”) in a reflow solder operation to attach a plurality of components to a top surface of the PCB; a plurality of recesses within the top plate, each recess comprising an opening in the bottom of the top plate, each recess sized to maintain a component of the plurality of components in an orientation for soldering to the PCB, the plurality of recesses positioned within the top plate to maintain each of the plurality of components on the PCB in a correct location for soldering to the PCB during the reflow solder operation; and one or more heat deflecting devices, each heat deflecting device comprising one of
a heat shielding device connected to the top plate and positioned over a recess of a component of the plurality of components and positioned on the top side of the top plate, each heat shielding device shaped to redirect heat flow directed toward a portion of the top side of the top plate above the recess of the component under the heat shielding device to a direction away from the recess of the component under the heat shielding device, each heat shielding device comprising a shape with a top portion that is narrower than a bottom portion nearest to the top plate; anda heat attracting device connected to the top plate and positioned to be centered about a recess of a component of the plurality of components and on the top side of the top plate, the heat attracting device shaped to redirect heat flow directed toward a portion of the top side of the top plate surrounding the recess of the component centered under the heat attracting device to a direction toward the recess of the component centered under the heat attracting device, each heat shielding device comprising a shape with a top portion that is wider than a bottom portion nearest to the top plate.