Run-to-run control utilizing virtual metrology in semiconductor manufacturing

摘要

An apparatus for performing run-to-run control and sampling optimization in a semiconductor manufacturing process includes at least one control module. The control module is operative: to determine a process output and corresponding metrology error associated with an actual metrology for a current processing run in the semiconductor manufacturing process; to determine a predicted process output and corresponding prediction error associated with a virtual metrology for the current processing run; and to control at least one parameter corresponding to a subsequent processing run as a function of the metrology error and the prediction error.

主权项

1. An apparatus for performing run-to-run control and sampling optimization in a semiconductor manufacturing process, the apparatus comprising:
at least one control module operative: to determine a process output and corresponding metrology error associated with an actual metrology for a current processing run in the semiconductor manufacturing process; to determine a predicted process output and corresponding prediction error associated with a virtual metrology for the current processing run; to control at least one parameter corresponding to a subsequent processing run as a function of the metrology error and the prediction error; to obtain a prediction model associated with the semiconductor manufacturing process, the prediction model being adapted to predict the process output by estimating at least one processing parameter for the semiconductor manufacturing process; and to perform virtual metrology based on the prediction model, the prediction error being determined as a function of an output of the virtual metrology; wherein the prediction model comprises a wafer quality prediction model for metrology variable prediction which utilizes tensor input process variables by directly operating on the tensor input process variables.