Stacked structures and methods of forming stacked structures

摘要

A stacked structure includes a first die bonded over a second die. The first die has a first die area defined over a first surface. At least one first protective structure is formed over the first surface, around the first die area. At least one side of the first protective structure has at least one first extrusion part extending across a first scribe line around the protective structure. The second die has a second die area defined over a second surface. At least one second protective structure is formed over the second surface, around the second die area. At least one side of the second protective structure has at least one second extrusion part extending across a second scribe line around the protective structure, wherein the first extrusion part is connected with the second extrusion part.

主权项

1. A method, comprising:
forming a plurality of first dies over a first surface of a first substrate, at least one of the first dies comprising a first die area and at least one first protective structure positioned around at least one of the first die areas, at least one side of the first protective structure having one first extension part extending to another first protective structure positioned around another first die area adjacent thereto; forming a plurality of second dies over a second surface of a second substrate, at least one of the second dies comprising a second die area and at least one second protective structure positioned around at least one of the second die areas, at least one side of the second protective structure having one second extension part extending to another second protective structure positioned around another second die area adjacent thereto; bonding the first surface of the first substrate with the second surface of the second substrate thereby connecting the first extension part and the second extension part, wherein the first extension part and the second extension part divide a scribe line channel formed between the first and second substrates after bonding into at least two isolated scribe line channels that are fluidly sealed from one another; and dicing the first substrate and the second substrate bonded thereover.