| 发明名称 | Method of manufacturing lead frame | ||
| 摘要 | There is provided a method of manufacturing a lead frame, the method including: preparing a lead frame raw material; forming openings in the lead frame raw material so that the lead frame material includes: a die pad; a die pad supporting portion supporting the die pad; a rail portion supporting the die pad supporting portion; a lead supporting portion having both ends fixed to the die pad supporting portion; and a plurality of leads having a first end connected to the rail portion and a second end connected to the lead supporting portion; plating the lead frame raw material having the openings with a plating layer; and removing the lead supporting portion. | ||
| 申请公布号 | US9299588(B2) | 申请公布日期 | 2016.03.29 |
| 申请号 | US201414182783 | 申请日期 | 2014.02.18 |
| 申请人 | HAESUNG DS CO., LTD | 发明人 | Kim Jeung-Il |
| 分类号 | H01L21/00;H01L21/48;H01L23/495;H01L23/31 | 主分类号 | H01L21/00 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. A method of manufacturing a lead frame, the method comprising: preparing a lead frame raw material; forming openings in the lead frame raw material so that the lead frame material comprises: a die pad;a die pad supporting portion supporting the die pad;a rail portion supporting the die pad supporting portion;a lead supporting portion having both ends fixed to the die pad supporting portion; anda plurality of leads having a first end connected to the rail portion and a second end connected to the lead supporting portion; plating the lead frame raw material having the openings with a plating layer; removing the lead supporting portion; and forming half etching portions on a surface of the lead frame raw material, wherein the removing the lead supporting portion comprises: moving the punch from an opposite surface of the surface having the half etching portions towards the surface having the half etching portions; andremoving the lead supporting portion. | ||
| 地址 | Changwon-si KR | ||