发明名称 |
Metal dewetting methods and articles produced thereby |
摘要 |
Described herein are improved dewetting methods and improved patterned articles produced using such methods. The improved methods and articles generally implement continuous ultra-thin metal-containing films or film stacks as the materials to be dewetted. For example, a method can involve the steps of providing a substrate that has a continuous ultra-thin metal-containing film or film stack disposed on a surface thereof, and dewetting at least a portion of the continuous ultra-thin metal-containing film or film stack to produce a plurality of discrete metal-containing dewetted islands on the surface of the substrate. |
申请公布号 |
US9296183(B2) |
申请公布日期 |
2016.03.29 |
申请号 |
US201213687208 |
申请日期 |
2012.11.28 |
申请人 |
Corning Incorporated |
发明人 |
Baker David Eugene;Carbonell Carme Gomez;Dawson-Elli David Francis;Mazumder Prantik;Pruneri Valerio;Tian Lili |
分类号 |
B32B3/10;B32B33/00;B05D3/02;C23C14/18;C23C14/58 |
主分类号 |
B32B3/10 |
代理机构 |
|
代理人 |
Patel Payal A. |
主权项 |
1. A patterned article, comprising:
a substrate; a continuous ultra-thin metal-containing film or film stack disposed on a surface of the substrate; and a plurality of discrete dewetted metal-containing islands disposed on a surface of the continuous ultra-thin metal-containing film or film stack; wherein the plurality of discrete metal-containing dewetted islands have an average height of about 5 nanometers to about 300 nanometers, an average longest lateral cross-sectional dimension of about 10 nanometers to about 1000 nanometers, and are randomly oriented on the surface of the continuous ultra-thin metal-containing film or film stack so as to cover less than or equal to about 0.5 of an area fraction of the surface of the continuous ultra-thin metal-containing film or film stack. |
地址 |
Corning NY US |