Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

摘要

A stackable microelectronic package includes a first microelectronic die attached to and electrically connecting with a first substrate. A second microelectronic die is attached to the first die on one side, and to a second substrate on the other side. Electrical connections are made between the first die and the first substrate, between the second die and the second substrate, and between the first and second substrates, e.g., via wire bonding. The electrical connecting elements are advantageously encased in a molding compound. Exposed contacts on the first and/or second substrates, not covered by the molding compound, provide for electrical connections between the package, and another package stacked onto the package. The package may avoid coplanarity factors, can be manufactured using existing equipment, allows for intermediate testing, and can also offer a thinner package height.

主权项

1. A microelectronic package, comprising:
a first substrate having a first external contact at a first surface and a first wire bond contact at a second surface opposite the first surface; a first microelectronic die proximate to the first substrate; a second substrate having a second external contact and a second wire bond contact at a third surface facing away from the first substrate; a second microelectronic die proximate to the second substrate; wherein the first and second microelectronic dies each have an active side including a plurality of active terminals, and a back side, and wherein the back side of the first microelectronic die is attached to the back side of the second microelectronic die; a first wire connecting the first surface of the first substrate to the first microelectronic die; and a molding compound at least partially encapsulating the first and second substrates and the first and second dies without covering the first external contact or the second external contact.