Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith

摘要

Embodiments of the present invention relate to a semiconductor chip comprising a plurality of contact pads, which are arranged in an edge area on a surface of the semiconductor chip. In a semiconductor area of the semiconductor chip, every contact pad of the plurality of contact pads has an associated pad cell provided, which includes at least one of a driver or a receiver and is configured to drive output signals or receive input signals on its associated contact pad, if the driver or receiver is connected to the contact pad. Additionally, for a contact pad which is used as a supply contact pad, the driver or receiver of the associated pad cell is not connected to the contact pad or any other contact pad for driving output signals or receiving input signals on the same.

主权项

1. A method for manufacturing a semiconductor chip comprising a plurality of contact pads, the method comprising the following steps:
providing for every contact pad of the plurality of contact pads an associated pad cell in a semiconductor area of the semiconductor chip, the associated pad cell comprising at least one of a driver and a receiver being configured to drive output signals or receive input signals on its associated contact pad, if the driver or receiver of the associated pad cell is connected to its associated contact pad; and providing the plurality of contact pads in an edge area on a surface of the semiconductor chip, wherein at least one contact pad of the plurality of contact pads is used as a supply contact pad, wherein the driver or receiver of the pad cells associated with the supply contact pad is not connected to the supply contact pad or any other contact pad of the plurality of contact pads for driving output signals or receiving input signals on these contact pads, and wherein the contact pads of the plurality of contact pads other than the at least one supply contact pad are connected to the driver or receiver of the associated pad cells for driving output signals or receiving input signals on these contact pads.