| 发明名称 | Device and method of manufacturing the same | ||
| 摘要 | A device includes a substrate having a base member and an insulation film formed on a surface of the base member, a first semiconductor chip mounted over a surface of the substrate on which the insulation film are formed, a second semiconductor chip stacked over the first semiconductor chip so that an overhang portion is formed, and a sealing member formed on the substrate so that the first semiconductor chip and the second semiconductor chip are covered with the sealing member. The insulation film has a first opening portion in a first area of the substrate that overlaps the overhang portion. The base member has an air passage communicating with the first opening portion. | ||
| 申请公布号 | US9299652(B2) | 申请公布日期 | 2016.03.29 |
| 申请号 | US201314422352 | 申请日期 | 2013.08.20 |
| 申请人 | PS5 LUXCO S.A.R.L. | 发明人 | Kindo Osamu |
| 分类号 | H01L23/48;H01L23/498;H01L23/31;H01L21/56;H01L23/00;H01L25/065;B29C45/26;B29C45/34;B29C45/14 | 主分类号 | H01L23/48 |
| 代理机构 | Kunzler Law Group | 代理人 | Kunzler Law Group |
| 主权项 | 1. A device comprising: a substrate having a base member and an insulation film formed on a surface of the base member; a first semiconductor chip mounted over a surface of the substrate on which the insulation film is formed; a second semiconductor chip stacked over the first semiconductor chip so that an overhang portion is formed; and a sealing member formed on the substrate so that the first semiconductor chip and the second semiconductor chip are covered with the sealing member, wherein the insulation film has a first opening portion in a first area of the substrate that overlaps the overhang portion, the base member has an air passage communicating with the first opening portion, the first area having a rectangular shape, and the first opening portion is formed at a central portion of the first area in a longitudinal direction of the first area and near the first semiconductor chip. | ||
| 地址 | Luxembourg LU | ||