Susceptor heater and method of heating a substrate

摘要

A wafer processing apparatus may include a susceptor having a top side and a backside, a susceptor heater having a spacing member and a heating member, a shim removably mounted between the susceptor and the susceptor heater, a cavity formed by the susceptor backside, the susceptor heater, and the shim, a fluid inlet communicating with the cavity, and a plurality of fluid outlets communicating with the cavity.

主权项

1. A susceptor heater assembly comprising:
a heating member having a top surface; a fluid manifold connected to the heating member; a shim removably mounted on the heating member; a susceptor having a bottom surface, the susceptor connected to the shim; a fluid line inlet traversing the heating member; a fluid line in fluid communication with a cavity between the bottom surface and the top surface; and a heat conductive fluid introduced through the fluid line inlet to provide heat conductive fluid to the cavity.