| 发明名称 | Ceramic substrate and method of manufacturing the same | ||
| 摘要 | A ceramic substrate is provided that includes a ceramic substrate main body having a principal surface, and a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder. The connecting terminal portion includes a copper layer and a coating metal layer covering a surface of the copper layer. The ceramic substrate includes a contact layer disposed between the ceramic substrate main body and the copper layer. The contact layer includes one of a nickel-chromium alloy, chromium, molybdenum, and palladium, and is set back from a side surface of the copper layer in a substrate plane direction. | ||
| 申请公布号 | US9301404(B2) | 申请公布日期 | 2016.03.29 |
| 申请号 | US201314133158 | 申请日期 | 2013.12.18 |
| 申请人 | NGK SPARK PLUG CO. LTD | 发明人 | Otsuka Yuma;Fukunaga Kazunori;Uchida Atsushi;Yoshimura Kouhei |
| 分类号 | H05K1/03;H05K1/18;H05K3/42;H05K3/40;C23C28/02;H05K3/24;H05K3/46 | 主分类号 | H05K1/03 |
| 代理机构 | Stites & Harbison, PLLC | 代理人 | Stites & Harbison, PLLC ;Haeberlin Jeffrey A. |
| 主权项 | 1. A ceramic substrate, comprising: a ceramic substrate main body having a principal surface; a connecting terminal portion disposed on the principal surface of the ceramic substrate main body for connection to a component via solder, the connecting terminal portion including a copper layer and a coating metal layer covering a surface of the copper layer; and a contact layer disposed between the ceramic substrate main body and the copper layer, the contact layer including one of a nickel-chromium alloy, chromium, molybdenum, and palladium, wherein the contact layer is set back from a side surface of the copper layer in a substrate plane direction such that a gap is formed between the copper layer and the ceramic substrate main body, and wherein the coating metal layer extends into the gap. | ||
| 地址 | Nagoya JP | ||