发明名称 |
Electronic unit |
摘要 |
An electronic unit includes an electronic body on which a heat generating component is mounted; a resin casing in which the electronic body is housed; and a heat diffusion sheet interposed between the casing and a region of the electronic body where the heat generating component is mounted. |
申请公布号 |
US9301385(B2) |
申请公布日期 |
2016.03.29 |
申请号 |
US201314053858 |
申请日期 |
2013.10.15 |
申请人 |
KOITO MANUFACTURING CO., LTD. |
发明人 |
Kurebayashi Toshihiko;Urushibata Mikio |
分类号 |
H05K7/20;H05K1/02;H05K5/00;F21V29/507 |
主分类号 |
H05K7/20 |
代理机构 |
Sughrue Mion, PLLC |
代理人 |
Sughrue Mion, PLLC |
主权项 |
1. An electronic unit comprising:
an electronic body on which a heat generating component is mounted; a resin casing in which the electronic body is housed; and a heat diffusion sheet interposed between the casing and a region of the electronic body where the heat generating component is mounted; wherein: the electronic body includes a circuit board in which the heat generating component is mounted on a first surface; the circuit board includes a heat transfer structure for transferring heat generated by the heat generating component toward a second surface that is on an opposite side of the circuit board from the first surface; the heat diffusion sheet is arranged between the second surface of the circuit board and an inside surface of the casing, in a state closely contacting the second surface of the circuit board and the inside surface of the casing; and the heat transfer structure is formed by a heat transfer pad that is formed by a portion of a conductive film on the first surface of the circuit board, and on which the heat generating component is mounted; a heat dissipating pad that is formed by a portion of a conductive film on the second surface of the circuit board; and a through-hole that passes through the circuit board in a thickness direction of the circuit board, for electrically connecting the heat transfer pad and the heat dissipating pad together. |
地址 |
Tokyo JP |