| 发明名称 | Package with multiple plane I/O structure | ||
| 摘要 | A embodiment package includes a three dimensional integrated circuit (3D IC) with first input/output pads on a first side and second input/output pads on a second side, a first fan out structure electrically coupled to the first input/output pads on the first side of the three dimensional integrated circuit, and a second fan out structure electrically coupled to the second input/output pads on the second side of the three dimensional integrated circuit. | ||
| 申请公布号 | US9299677(B2) | 申请公布日期 | 2016.03.29 |
| 申请号 | US201314144813 | 申请日期 | 2013.12.31 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Yu Hung-Chang;Lin Kai-Chun;Chih Yue-Der |
| 分类号 | H01L29/80;H01L23/00;H01L23/498;H01L21/56;H01L23/31;H01L25/065 | 主分类号 | H01L29/80 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A package, comprising: a three dimensional integrated circuit with first input/output pads on a first side and second input/output pads on a second side, wherein the first input/output pads have a first pitch different from a second pitch of the second input/output pads; a first fan out structure electrically coupled to the first input/output pads on the first side of the three dimensional integrated circuit; and a second fan out structure electrically coupled to the second input/output pads on the second side of the three dimensional integrated circuit. | ||
| 地址 | Hsin-Chu TW | ||