A MOLDING PRESS AND A PLATEN FOR A MOLDING PRESS

摘要

The present invention discloses a platen for a molding press for encapsulating semiconductor dies on a substrate. The platen includes a first mold chase having a first mold chase surface. The platen further includes a rotation installation device: operating to cooperate with an additional platen having a second mold chase with a second mold chase surface to clamp the substrate held on a substrate facing surface about the first or second chase surface between the first and second chase surfaces in order to define at least one mold cavity for the substrate; and rotating around at least one axis passing through the center of the substrate facing surface for the first or second mold chase to adjust relative arrangements of the first and second mold chase surfaces. The present invention also provides a molding press including the additional platen cooperating with the platen.