CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

摘要

The present invention relates to a chip electronic component. The chip electronic component includes: an insulation substrate; a first inner coil unit disposed on one surface of the insulation substrate; a second inner coil unit disposed on the other surface facing the one surface of the insulation substrate; a via connecting the first inner coil unit and the second inner coil unit by penetrating the insulation substrate; a first via pad disposed on the one surface of the insulation substrate and a second via pad disposed on the other surface of the insulation substrate to cover the via; and a first dummy pattern disposed on the one surface of the insulation substrate and in a region adjacent to the first via pad and a second dummy pattern disposed on the other surface of the insulation substrate and in a region adjacent to the second via pad. According to one embodiment of the present invention, the chip electronic component can prevent a short defect caused by overgrowth of the via pads by suppressing the overgrowth of the via pads and a loss of inductance caused by areas of the via pads.